The most common physical package for UFS 3.1 is the , measuring approximately 11.5mm x 13.0mm. The reduced pin count compared to eMMC simplifies PCB routing while enabling much higher bandwidth.
UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global ufs 3.1 pinout
According to technical specifications from Arasan Chip Systems and Kingston , the pinout is categorized into high-speed data lanes, power supply lines, and control signals. The most common physical package for UFS 3
Power supply for the controller and I/O interface, typically 1.14V to 1.26V (nominal 1.2V). Power supply for the controller and I/O interface,
Differential data lanes for sending information from the host to the storage device.
Differential data lanes for receiving data from the storage device to the host.
Provides the base frequency for the M-PHY. Modern UFS 3.1 devices like those from Samsung Semiconductor require a precise reference clock to transition into high-speed modes.